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產品展示
層數:4層
Number of layers:4layers
板厚:10mm
Thickness:1.0mm
最小孔徑:0.4mm
Min.hole:0.4mm
材料:RO4350+FR-4
Base material:RO4350+FR-4
技術特點:盲孔、混壓
Technical Feature: Blind hole, mix lamination
層數:4層
Number of layers: 4 layers
板厚:06mm
Thickness:0.6mm
最小孔徑:0.3mm
Min.hole:0.3mm
材料: TSM-DS3+FR-28
Base material: TSM-DS3+FR-28
技術特點:內層埋平面電阻、階梯
Technical Feature: Planar embedded resistor in inner layer, step
層數:4層
Number of layers:4layers
板厚:1.0mm
Thickness:1.0mm
最小孔徑:0.3mm
Min.hole:0.3mm
材料:F4B+FR-4
Base material:F4B+FR-4
技術特點:階梯、可立體安裝
Technical Feature: Step, vertical assembly
層數:2層
Number of layers: 2 layers
板厚:0508m
Thickness: 0.508mr
最小孔徑:0.8mm
Min. hole size: 0.8mr
材料:RT6010
Base mateial:RT6010
技術特點:高精度
TechnicalFeature:High precision
層數:4層
Number of layers: 4 layers
板厚:1.6mm
Thickness:1.6mm
最小孔徑:0.4mm
Min.hole:0.4mm
材料:PPE
Base material:PPE
技術特點:工藝簡化、可替代PTF材料
Technical Feature: Simple process,Substitute of PTFE material
層數:4層
Numberof]layers:4layers
板厚:0.8mm
Thickness:0.8mm
最小孔徑:30mm
Min.hole:3.0mm
材料:RT5880+FR-4
Base material:RT5880+FR-4
技術特點:FR-4與PTFE混壓
Technical Feature:Mix lamination of FR-4 and PTFE
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